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1. general description the 74aup1g79 provides the single positive-edge triggered d-type flip-flop. information on the data input is transferred to the q output on the low-to-high transition of the clock pulse. the d input must be stable one setup time prior to the low-to-high clock transition for predictable operation. schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire v cc range from 0.8 v to 3.6 v. this device ensures a very low static and dynamic power consumption across the entire v cc range from 0.8 v to 3.6 v. this device is fully specified for pa rtial power-down ap plications using i off . the i off circuitry disables the output, preventin g the damaging backflow current through the device when it is powered down. 2. features and benefits ? wide supply voltage range from 0.8 v to 3.6 v ? high noise immunity ? complies with jedec standards: ? jesd8-12 (0.8 v to 1.3 v) ? jesd8-11 (0.9 v to 1.65 v) ? jesd8-7 (1.2 v to 1.95 v) ? jesd8-5 (1.8 v to 2.7 v) ? jesd8-b (2.7 v to 3.6 v) ? esd protection: ? hbm jesd22-a114f class 3a exceeds 5000 v ? mm jesd22-a115-a exceeds 200 v ? cdm jesd22-c101e exceeds 1000 v ? low static power consumption; i cc = 0.9 ? a (maximum) ? latch-up performance exceeds 100 ma per jesd 78 class ii ? inputs accept voltages up to 3.6 v ? low noise overshoot and undershoot < 10 % of v cc ? i off circuitry provides partial power-down mode operation ? multiple package options ? specified from ? 40 ? cto+85 ? c and ? 40 ? cto+125 ? c 74aup1g79 low-power d-type flip-flop ; positive-edge trigger rev. 6 ? 28 june 2012 product data sheet
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 2 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger 3. ordering information 4. marking [1] the pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. functional diagram table 1. ordering information type number package temperature range name description version 74aup1g79gv ? 40 ? cto+125 ? c sc-74a plastic surface-mounted package; 5 leads sot753 74AUP1G79GW ? 40 ? c to +125 ? c tssop5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm sot353-1 74aup1g79gm ? 40 ? c to +125 ? c xson6 plastic extremely thin sm all outline package; no leads; 6 terminals; body 1 ? 1.45 ? 0.5 mm sot886 74aup1g79gf ? 40 ? c to +125 ? c xson6 plastic extremely thin sm all outline package; no leads; 6 terminals; body 1 ? 1 ? 0.5 mm sot891 74aup1g79gn ? 40 ? c to +125 ? c xson6 extremely thin small outline package; no leads; 6 terminals; body 0.9 ? 1.0 ? 0.35 mm sot1115 74aup1g79gs ? 40 ? c to +125 ? c xson6 extremely thin small outline package; no leads; 6 terminals; body 1.0 ? 1.0 ? 0.35 mm sot1202 74aup1g79gx ? 40 ? c to +125 ? c x2son5 x2son5: plastic thermal enhanced extremely thin small outline package; no leads; 5 terminals; body 0.8 ? 0.8 ? 0.35 mm sot1226 table 2. marking type number marking code [1] 74aup1g79gv p79 74AUP1G79GW pp 74aup1g79gm pp 74aup1g79gf pp 74aup1g79gn pp 74aup1g79gs pp 74aup1g79gx pp fig 1. logic symbol fig 2. iec logic symbol mna440 2 1 cp d4 q mna441 2 dq cp 14
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 3 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger 6. pinning information 6.1 pinning fig 3. logic diagram mna442 cp d c c c c c c c c c tg tg tg tg q c fig 4. pin configuration sot353-1 and sot753 fig 5. pin configuration sot886 74aup1g79 dv cc cp gnd q 001aac562 1 2 3 5 4 74aup1g79 cp 001aac524 d gnd n.c. v cc q transparent top view 2 3 1 5 4 6 fig 6. pin configuration sot891, sot1115 and sot1202 fig 7. pin configuration sot1226 (x2son5) 74aup1g79 cp 001aaf179 d gnd n.c. v cc q transparent top view 2 3 1 5 4 6 d v cc gnd 1 3 2 5 4 cp q aaa-003007 transparent top view 74aup1g79
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 4 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger 6.2 pin description 7. functional description [1] h = high voltage level; l = low voltage level; ? = low-to-high cp transition; x = don?t care; q = lower case letter indicates the state of referenced i nput, one setup time prior to the low-to-high cp transition. 8. limiting values [1] the input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] for tssop5 and sc-74a packages: above 87.5 ? c the value of p tot derates linearly with 4.0 mw/k. for xson6 and x2son5 packages: above 118 ? c the value of p tot derates linearly with 7.8 mw/k. table 3. pin description symbol pin description tssop5 and x2son5 xson6 d 1 1 data input cp 2 2 clock pulse input gnd 3 3 ground (0 v) q 4 4 data output n.c. - 5 not connected v cc 5 6 supply voltage table 4. function table [1] input output cp d q ? ll ? hh lxq table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage ? 0.5 +4.6 v i ik input clamping current v i <0v ? 50 - ma v i input voltage [1] ? 0.5 +4.6 v i ok output clamping current v o <0v ? 50 - ma v o output voltage active mode and power-down mode [1] ? 0.5 +4.6 v i o output current v o =0 vtov cc - ? 20 ma i cc supply current - 50 ma i gnd ground current ? 50 - ma t stg storage temperature ? 65 +150 ? c p tot total power dissipation t amb = ? 40 ? c to +125 ?c [2] -2 5 0m w
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 5 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger 9. recommended operating conditions 10. static characteristics table 6. recommended operating conditions symbol parameter conditions min max unit v cc supply voltage 0.8 3.6 v v i input voltage 0 3.6 v v o output voltage active mode 0 v cc v power-down mode; v cc =0v 0 3.6 v t amb ambient temperature ? 40 +125 ?c ? t/ ? v input transition rise and fall rate v cc = 0.8 v to 3.6 v 0 200 ns/v table 7. static characteristics at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit t amb = 25 ?c v ih high-level input voltage v cc = 0.8 v 0.70 ? v cc -- v v cc = 0.9 v to 1.95 v 0.65 ? v cc -- v v cc = 2.3 v to 2.7 v 1.6 - - v v cc = 3.0 v to 3.6 v 2.0 - - v v il low-level input voltage v cc = 0.8 v - - 0.30 ? v cc v v cc = 0.9 v to 1.95 v - - 0.35 ? v cc v v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 3.0 v to 3.6 v - - 0.9 v v oh high-level output voltage v i = v ih or v il i o = ? 20 ? a; v cc = 0.8 v to 3.6 v v cc ? 0.1 - - v i o = ? 1.1 ma; v cc = 1.1 v 0.75 ? v cc -- v i o = ? 1.7 ma; v cc = 1.4 v 1.11 - - v i o = ? 1.9 ma; v cc = 1.65 v 1.32 - - v i o = ? 2.3 ma; v cc = 2.3 v 2.05 - - v i o = ? 3.1 ma; v cc = 2.3 v 1.9 - - v i o = ? 2.7 ma; v cc = 3.0 v 2.72 - - v i o = ? 4.0 ma; v cc = 3.0 v 2.6 - - v v ol low-level output voltage v i = v ih or v il i o = 20 ? a; v cc = 0.8 v to 3.6 v - - 0.1 v i o = 1.1 ma; v cc = 1.1 v - - 0.3 ? v cc v i o = 1.7 ma; v cc = 1.4 v - - 0.31 v i o = 1.9 ma; v cc = 1.65 v - - 0.31 v i o = 2.3 ma; v cc = 2.3 v - - 0.31 v i o = 3.1 ma; v cc = 2.3 v - - 0.44 v i o = 2.7 ma; v cc = 3.0 v - - 0.31 v i o = 4.0 ma; v cc = 3.0 v - - 0.44 v
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 6 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger i i input leakage current v i = gnd to 3.6 v; v cc = 0 v to 3.6 v - - ? 0.1 ? a i off power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v - - ? 0.2 ? a ? i off additional power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v to 0.2 v -- ? 0.2 ? a i cc supply current v i = gnd or v cc ; i o = 0 a; v cc = 0.8 v to 3.6 v --0.5 ? a ? i cc additional supply current per pin; v i = v cc ? 0.6 v; i o = 0 a; v cc =3.3v [1] --4 0 ? a c i input capacitance v cc = 0 v to 3.6 v; v i = gnd or v cc -0 . 8-p f c o output capacitance v o = gnd; v cc = 0 v - 1.7 - pf t amb = ? 40 ?c to +85 ?c v ih high-level input voltage v cc = 0.8 v 0.70 ? v cc -- v v cc = 0.9 v to 1.95 v 0.65 ? v cc -- v v cc = 2.3 v to 2.7 v 1.6 - - v v cc = 3.0 v to 3.6 v 2.0 - - v v il low-level input voltage v cc = 0.8 v - - 0.30 ? v cc v v cc = 0.9 v to 1.95 v - - 0.35 ? v cc v v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 3.0 v to 3.6 v - - 0.9 v v oh high-level output voltage v i = v ih or v il i o = ? 20 ? a; v cc = 0.8 v to 3.6 v v cc ? 0.1 - - v i o = ? 1.1 ma; v cc = 1.1 v 0.7 ? v cc -- v i o = ? 1.7 ma; v cc = 1.4 v 1.03 - - v i o = ? 1.9 ma; v cc = 1.65 v 1.30 - - v i o = ? 2.3 ma; v cc = 2.3 v 1.97 - - v i o = ? 3.1 ma; v cc = 2.3 v 1.85 - - v i o = ? 2.7 ma; v cc = 3.0 v 2.67 - - v i o = ? 4.0 ma; v cc = 3.0 v 2.55 - - v v ol low-level output voltage v i = v ih or v il i o = 20 ? a; v cc = 0.8 v to 3.6 v - - 0.1 v i o = 1.1 ma; v cc = 1.1 v - - 0.3 ? v cc v i o = 1.7 ma; v cc = 1.4 v - - 0.37 v i o = 1.9 ma; v cc = 1.65 v - - 0.35 v i o = 2.3 ma; v cc = 2.3 v - - 0.33 v i o = 3.1 ma; v cc = 2.3 v - - 0.45 v i o = 2.7 ma; v cc = 3.0 v - - 0.33 v i o = 4.0 ma; v cc = 3.0 v - - 0.45 v i i input leakage current v i = gnd to 3.6 v; v cc = 0 v to 3.6 v - - ? 0.5 ? a i off power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v - - ? 0.5 ? a ? i off additional power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v to 0.2 v -- ? 0.6 ? a table 7. static characteristics ?continued at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 7 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger [1] one input at v cc ? 0.6 v, other input at v cc or gnd. i cc supply current v i = gnd or v cc ; i o = 0 a; v cc = 0.8 v to 3.6 v --0.9 ? a ? i cc additional supply current per pin; v i = v cc ? 0.6 v; i o = 0 a; v cc =3.3v [1] --5 0 ? a t amb = ? 40 ? c to +125 ?c v ih high-level input voltage v cc = 0.8 v 0.75 ? v cc -- v v cc = 0.9 v to 1.95 v 0.70 ? v cc -- v v cc = 2.3 v to 2.7 v 1.6 - - v v cc = 3.0 v to 3.6 v 2.0 - - v v il low-level input voltage v cc = 0.8 v - - 0.25 ? v cc v v cc = 0.9 v to 1.95 v - - 0.30 ? v cc v v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 3.0 v to 3.6 v - - 0.9 v v oh high-level output voltage v i = v ih or v il i o = ? 20 ? a; v cc = 0.8 v to 3.6 v v cc ? 0.11 - - v i o = ? 1.1 ma; v cc = 1.1 v 0.6 ? v cc -- v i o = ? 1.7 ma; v cc = 1.4 v 0.93 - - v i o = ? 1.9 ma; v cc = 1.65 v 1.17 - - v i o = ? 2.3 ma; v cc = 2.3 v 1.77 - - v i o = ? 3.1 ma; v cc = 2.3 v 1.67 - - v i o = ? 2.7 ma; v cc = 3.0 v 2.40 - - v i o = ? 4.0 ma; v cc = 3.0 v 2.30 - - v v ol low-level output voltage v i = v ih or v il i o = 20 ? a; v cc = 0.8 v to 3.6 v - - 0.11 v i o = 1.1 ma; v cc = 1.1 v - - 0.33 ? v cc v i o = 1.7 ma; v cc = 1.4 v - - 0.41 v i o = 1.9 ma; v cc = 1.65 v - - 0.39 v i o = 2.3 ma; v cc = 2.3 v - - 0.36 v i o = 3.1 ma; v cc = 2.3 v - - 0.50 v i o = 2.7 ma; v cc = 3.0 v - - 0.36 v i o = 4.0 ma; v cc = 3.0 v - - 0.50 v i i input leakage current v i = gnd to 3.6 v; v cc = 0 v to 3.6 v - - ? 0.75 ? a i off power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v - - ? 0.75 ? a ? i off additional power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v to 0.2 v -- ? 0.75 ? a i cc supply current v i = gnd or v cc ; i o = 0 a; v cc = 0.8 v to 3.6 v --1.4 ? a ? i cc additional supply current per pin; v i = v cc ? 0.6 v; i o = 0 a; v cc =3.3v [1] --7 5 ? a table 7. static characteristics ?continued at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 8 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger 11. dynamic characteristics table 8. dynamic characteristics voltages are referenced to gnd (ground = 0 v); for test circuit see figure 10 . symbol parameter conditions 25 ?c ? 40 ? c to +125 ? c unit min typ [1] max min (85 ?c) max (85 ?c) min (125 ?c) max (125 ?c) c l = 5 pf t pd propagation delay cp to q; see figure 8 [2] v cc = 0.8 v - 19.7 - - - - - ns v cc = 1.1 v to 1.3 v 2.6 5.5 11.0 2.4 12.9 2.4 14.2 ns v cc = 1.4 v to 1.6 v 2.0 3.8 7.0 1.8 8.1 1.8 9.0 ns v cc = 1.65 v to 1.95 v 1.7 3.1 5.4 1.5 6.4 1.5 7.1 ns v cc = 2.3 v to 2.7 v 1.4 2.3 4.0 1.1 4.7 1.1 5.2 ns v cc = 3.0 v to 3.6 v 1.2 2.0 3.4 0.9 4.0 0.9 4.4 ns f max maximum frequency cp; see figure 9 v cc = 0.8 v - 53 - - - - - mhz v cc = 1.1 v to 1.3 v - 203 - 170 - 170 - mhz v cc = 1.4 v to 1.6 v - 347 - 310 - 300 - mhz v cc = 1.65 v to 1.95 v - 435 - 400 - 390 - mhz v cc = 2.3 v to 2.7 v - 550 - 490 - 480 - mhz v cc = 3.0 v to 3.6 v - 619 - 550 - 510 - mhz c l = 10 pf t pd propagation delay cp to q; see figure 8 [2] v cc = 0.8 v - 23.1 - - - - - ns v cc = 1.1 v to 1.3 v 3.1 6.3 12.3 2.8 14.4 2.8 15.9 ns v cc = 1.4 v to 1.6 v 2.5 4.4 8.1 2.2 9.5 2.2 10.5 ns v cc = 1.65 v to 1.95 v 2.1 3.6 6.3 1.9 7.5 1.9 8.3 ns v cc = 2.3 v to 2.7 v 1.8 2.8 4.7 1.5 5.6 1.5 6.2 ns v cc = 3.0 v to 3.6 v 1.7 2.5 4.1 1.3 4.5 1.3 5.0 ns f max maximum frequency cp; see figure 9 v cc = 0.8 v - 52 - - - - - mhz v cc = 1.1 v to 1.3 v - 192 - 150 - 150 - mhz v cc = 1.4 v to 1.6 v - 324 - 280 - 230 - mhz v cc = 1.65 v to 1.95 v - 421 - 310 - 250 - mhz v cc = 2.3 v to 2.7 v - 486 - 370 - 360 - mhz v cc = 3.0 v to 3.6 v - 550 - 410 - 360 - mhz
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 9 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger c l = 15 pf t pd propagation delay cp to q; see figure 8 [2] v cc = 0.8 v - 26.6 - - - - - ns v cc = 1.1 v to 1.3 v 3.5 7.1 13.6 3.2 15.6 3.2 17.2 ns v cc = 1.4 v to 1.6 v 2.8 5.0 9.2 2.5 10.7 2.5 11.8 ns v cc = 1.65 v to 1.95 v 2.4 4.1 7.1 2.2 8.5 2.2 9.4 ns v cc = 2.3 v to 2.7 v 2.2 3.2 5.4 1.9 6.3 1.9 7.0 ns v cc = 3.0 v to 3.6 v 2.0 2.9 4.5 1.6 5.0 1.6 5.5 ns f max maximum frequency cp; see figure 9 v cc = 0.8 v - 50 - - - - - mhz v cc = 1.1 v to 1.3 v - 181 - 120 - 120 - mhz v cc = 1.4 v to 1.6 v - 301 - 190 - 160 - mhz v cc = 1.65 v to 1.95 v - 407 - 240 - 190 - mhz v cc = 2.3 v to 2.7 v - 422 - 300 - 270 - mhz v cc = 3.0 v to 3.6 v - 481 - 320 - 300 - mhz c l = 30 pf t pd propagation delay cp to q; see figure 8 [2] v cc = 0.8 v - 36.8 - - - - - ns v cc = 1.1 v to 1.3 v 4.7 9.3 17.3 4.2 23.3 4.2 25.6 ns v cc = 1.4 v to 1.6 v 3.8 6.4 11.8 3.3 14.3 3.3 15.7 ns v cc = 1.65 v to 1.95 v 3.3 5.3 9.4 3.0 11.3 3.0 12.4 ns v cc = 2.3 v to 2.7 v 3.0 4.3 7.0 2.7 8.5 2.7 9.4 ns v cc = 3.0 v to 3.6 v 2.8 3.9 5.8 2.6 7.2 2.6 7.9 ns f max maximum frequency cp; see figure 9 v cc = 0.8 v - 28 - - - - - mhz v cc = 1.1 v to 1.3 v - 128 - 70 - 70 - mhz v cc = 1.4 v to 1.6 v - 206 - 120 - 110 - mhz v cc = 1.65 v to 1.95 v - 262 - 150 - 120 - mhz v cc = 2.3 v to 2.7 v - 269 - 190 - 170 - mhz v cc = 3.0 v to 3.6 v - 309 - 200 - 190 - mhz table 8. dynamic characteristics ?continued voltages are referenced to gnd (ground = 0 v); for test circuit see figure 10 . symbol parameter conditions 25 ?c ? 40 ? c to +125 ? c unit min typ [1] max min (85 ?c) max (85 ?c) min (125 ?c) max (125 ?c)
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 10 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger c l = 5 pf, 10 pf, 15 pf and 30 pf t su set-up time high; d to cp; see figure 9 v cc = 0.8 v - 3.4 - - - - - ns v cc = 1.1 v to 1.3 v - 0.8 - 1.6 - 1.4 - ns v cc = 1.4 v to 1.6 v - 0.5 - 1.0 - 1.0 - ns v cc = 1.65 v to 1.95 v - 0.5 - 0.9 - 0.9 - ns v cc = 2.3 v to 2.7 v - 0.4 - 0.7 - 0.7 - ns v cc = 3.0 v to 3.6 v - 0.4 - 0.6 - 0.6 - ns low; d to cp; see figure 9 v cc = 0.8 v - 3.0 - - - - - ns v cc = 1.1 v to 1.3 v - 0.9 - 1.4 - 1.4 - ns v cc = 1.4 v to 1.6 v - 0.6 - 1.0 - 1.0 - ns v cc = 1.65 v to 1.95 v - 0.5 - 0.9 - 0.9 - ns v cc = 2.3 v to 2.7 v - 0.5 - 0.8 - 0.8 - ns v cc = 3.0 v to 3.6 v - 0.7 - 1.0 - 1.0 - ns t h hold time d to cp; see figure 9 v cc = 0.8 v - -1.9 - - - - - ns v cc = 1.1 v to 1.3 v - -0.6 - 0.2 - 0.2 - ns v cc = 1.4 v to 1.6 v - -0.4 - 0 - 0 - ns v cc = 1.65 v to 1.95 v - -0.4 - 0 - 0 - ns v cc = 2.3 v to 2.7 v - -0.4 - 0 - 0 - ns v cc = 3.0 v to 3.6 v - -0.3 - 0 - 0 - ns t w pulse width high or low; cp; see figure 9 v cc = 0.8 v - 5.6 - - - - - ns v cc = 1.1 v to 1.3 v - 2.4 - 3.5 - 3.5 - ns v cc = 1.4 v to 1.6 v - 1.3 - 2.0 - 2.0 - ns v cc = 1.65 v to 1.95 v - 0.9 - 1.9 - 1.9 - ns v cc = 2.3 v to 2.7 v - 0.7 - 2.0 - 2.0 - ns v cc = 3.0 v to 3.6 v - 0.6 - 2.2 - 2.2 - ns table 8. dynamic characteristics ?continued voltages are referenced to gnd (ground = 0 v); for test circuit see figure 10 . symbol parameter conditions 25 ?c ? 40 ? c to +125 ? c unit min typ [1] max min (85 ?c) max (85 ?c) min (125 ?c) max (125 ?c)
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 11 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger [1] all typical values are measured at nominal v cc . [2] t pd is the same as t plh and t phl . [3] c pd is used to determine the dynamic power dissipation (p d in ? w). p d =c pd ? v cc 2 ? f i ? n+ ? (c l ? v cc 2 ? f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v cc = supply voltage in v; n = number of inputs switching; ? (c l ? v cc 2 ? f o ) = sum of the outputs. c pd power dissipation capacitance f i = 1 mhz; v i = gnd to v cc [3] v cc = 0.8 v - 1.6 - - - - - pf v cc = 1.1 v to 1.3 v - 1.7 - - - - - pf v cc = 1.4 v to 1.6 v - 1.8 - - - - - pf v cc = 1.65 v to 1.95 v - 1.9 - - - - - pf v cc = 2.3 v to 2.7 v - 2.3 - - - - - pf v cc = 3.0 v to 3.6 v - 2.7 - - - - - pf table 8. dynamic characteristics ?continued voltages are referenced to gnd (ground = 0 v); for test circuit see figure 10 . symbol parameter conditions 25 ?c ? 40 ? c to +125 ? c unit min typ [1] max min (85 ?c) max (85 ?c) min (125 ?c) max (125 ?c)
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 12 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger 12. waveforms measurement points are given in table 9 . logic levels: v ol and v oh are typical output voltage drops that occur with the output load. fig 8. the clock input (cp) to output (q) propagation delays mna443 cp input q output t phl t plh v m v m v oh v i gnd d input v i gnd v ol v m v m measurement points are given in table 9 . logic levels: v ol and v oh are typical output voltage drops that occur with the output load. fig 9. the clock input (cp) to output (q) propagation delays, cp clock pulse width, d to cp setup times, cp to d hold times and the cp maximum frequency mna647 t h t su t h t phl t w t plh t su 1/f max v m v m v m v i gnd v i gnd cp input d input v oh v ol q output table 9. measurement points supply voltage output input v cc v m v m v i t r = t f 0.8 v to 3.6 v 0.5 ? v cc 0.5 ? v cc v cc ? 3.0 ns
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 13 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger [1] for measuring enable and disable times r l = 5 k ? , for measuring propagation delays, setup and hold times and pulse width r l = 1 m ? . test data is given in table 10 . definitions for test circuit: r l = load resistance. c l = load capacitance including jig and probe capacitance. r t = termination resistance should be equal to the output impedance z o of the pulse generator. v ext = external voltage for measuring switching times. fig 10. test circuit for measuring switching times 001aac521 dut r t v i v o v ext v cc r l 5 k c l g table 10. test data supply voltage load v ext v cc c l r l [1] t plh , t phl t pzh , t phz t pzl , t plz 0.8 v to 3.6 v 5 pf, 10 pf, 15 pf and 30 pf 5 k ? or 1 m ? open gnd 2 ? v cc
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 14 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger 13. package outline fig 11. package outline sot353-1 (tssop5) unit a 1 a max. a 2 a 3 b p lh e l p wy v ce d (1) e (1) z (1) references outline version european projection issue date iec jedec jeita mm 0.1 0 1.0 0.8 0.30 0.15 0.25 0.08 2.25 1.85 1.35 1.15 0.65 e 1 1.3 2.25 2.0 0.60 0.15 7 0 0.1 0.1 0.3 0.425 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 0.46 0.21 sot353-1 mo-203 sc-88a 00-09-01 03-02-19 w m b p d z e e 1 0.15 13 5 4 a a 2 a 1 l p (a 3 ) detail x l h e e c v m a x a y 1.5 3 mm 0 scale tssop5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm sot353-1 1.1
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 15 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger fig 12. package outline sot753 (sc-74a) references outline version european projection issue date iec jedec jeita sot753 sc-74a wb m b p d e a a 1 l p q detail x h e e v m a a b y 0 1 2 mm scale c x 13 2 4 5 plastic surface-mounted package; 5 leads sot753 unit a 1 b p cd e h e l p qy wv mm 0.100 0.013 0.40 0.25 3.1 2.7 0.26 0.10 1.7 1.3 e 0.95 3.0 2.5 0.2 0.1 0.2 dimensions (mm are the original dimensions) 0.6 0.2 0.33 0.23 a 1.1 0.9 02-04-16 06-03-16
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 16 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger fig 13. package outline sot886 (xson6) references outline version european projection issue date iec jedec jeita sot886 mo-252 sot886_po 04-07-22 12-01-05 unit mm max nom min 0.5 0.04 1.50 1.45 1.40 1.05 1.00 0.95 0.35 0.30 0.27 0.40 0.35 0.32 0.6 a (1) dimensions (mm are the original dimensions) notes 1. including plating thickness. 2. can be visible in some manufacturing processes. xson6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm sot886 a 1 b 0.25 0.20 0.17 deee 1 0.5 ll 1 terminal 1 index area d e e 1 e a 1 b l l 1 e 1 0 1 2 mm scale 1 6 2 5 3 4 6x (2) 4x (2) a
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 17 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger fig 14. package outline sot891 (xson6) terminal 1 index area references outline version european projection issue date iec jedec jeita sot891 sot891 05-04-06 07-05-15 xson6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm d e e 1 e a 1 b l l 1 e 1 0 1 2 mm scale dimensions (mm are the original dimensions) unit mm 0.20 0.12 1.05 0.95 0.35 0.27 a 1 max b e 1.05 0.95 d ee 1 l 0.40 0.32 l 1 0.35 0.55 a max 0.5 0.04 1 6 2 5 3 4 a 6 (1) 4 (1) note 1. can be visible in some manufacturing processes.
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 18 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger fig 15. package outline sot1115 (xson6) references outline version european projection issue date iec jedec jeita sot1115 sot1115_po 10-04-02 10-04-07 unit mm max nom min 0.35 0.04 0.95 0.90 0.85 1.05 1.00 0.95 0.55 0.3 0.40 0.35 0.32 a (1) dimensions note 1. including plating thickness. 2. visible depending upon used manufacturing technology. xson6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1.0 x 0.35 mm sot1115 a 1 b 0.20 0.15 0.12 deee 1 l 0.35 0.30 0.27 l 1 0 0.5 1 mm scale terminal 1 index area d e (4) (2) e 1 e 1 e l l 1 b 321 6 5 4 (6) (2) a 1 a
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 19 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger fig 16. package outline sot1202 (xson6) references outline version european projection issue date iec jedec jeita sot1202 sot1202_po 10-04-02 10-04-06 unit mm max nom min 0.35 0.04 1.05 1.00 0.95 1.05 1.00 0.95 0.55 0.35 0.40 0.35 0.32 a (1) dimensions note 1. including plating thickness. 2. visible depending upon used manufacturing technology. xson6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm sot1202 a 1 b 0.20 0.15 0.12 deee 1 l 0.35 0.30 0.27 l 1 0 0.5 1 mm scale terminal 1 index area d e (4) (2) e 1 e 1 e l b 123 l 1 6 5 4 (6) (2) a a 1
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 20 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger fig 17. package outline sot1226 (x2son5) references outline version european projection issue date iec jedec eiaj sot1226 sot1226_po 12-04-10 12-04-25 unit mm max nom min 0.35 0.85 0.80 0.75 0.04 0.30 0.25 0.20 0.85 0.80 0.75 0.27 0.22 0.17 0.05 a (1) dimensions note 1. dimension a is including plating thickness. 2. plastic or metal protrusions of 0.075 mm maximum per side are not included. sot1226 a 1 a 3 0.128 0.040 dd h ebe 0.48 klv 0.1 wy 0.05 0.05 scale 01 m m x terminal 1 index area d e a b detail x a a 1 a 3 c y c y 1 54 terminal 1 index area d h l b k e ac b v c w 2 1 0.20 0.27 0.22 0.17 y 1 x2son5: plastic thermal enhanced extremely thin small outline package; no leads; 5 terminals; body 0.8 x 0.8 x 0.35 mm 3
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 21 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger 14. abbreviations 15. revision history table 11. abbreviations acronym description cdm charged device model dut device under test esd electrostatic discharge hbm human body model mm machine model table 12. revision history document id release date data sheet status change notice supersedes 74aup1g79 v.6 20120628 product data sheet - 74aup1g79 v.5 modifications: ? added type number 74aup1g79gx (sot1226) ? package outline drawing of sot886 ( figure 13 ) modified. 74aup1g79 v.5 20111128 product data sheet - 74aup1g79 v.4 modifications: ? legal pages updated. 74aup1g79 v.4 20100720 product data sheet - 74aup1g79 v.3 74aup1g79 v.3 20090803 product data sheet - 74aup1g79 v.2 74aup1g79 v.2 20061017 product data sheet - 74aup1g79 v.1 74aup1g79 v.1 20050912 product data sheet - -
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 22 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 16.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
74aup1g79 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 6 ? 28 june 2012 23 of 24 nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. translations ? a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors 74aup1g79 low-power d-type flip-flop; positive-edge trigger ? nxp b.v. 2012. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 28 june 2012 document identifier: 74aup1g79 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 functional description . . . . . . . . . . . . . . . . . . . 4 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 recommended operating conditions. . . . . . . . 5 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 8 12 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 21 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 21 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 22 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 22 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 23 17 contact information. . . . . . . . . . . . . . . . . . . . . 23 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

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